
As semiconductor technologies develop, manufacturers continuously seek new methods to enhance performance while minimizing form factors. One of the most promising advancements in this field is 3D integration, a pivotal approach that changes semiconductor packaging. Erik Hosler, a thought leader in semiconductor technology, highlights that 3D integration is not just about stacking chips but about enabling greater functionality and efficiency. This technology is set to redefine how the industry approaches chip design and manufacturing.
The drive toward more compact and powerful electronic devices have spurred the need for innovative packaging solutions. By stacking multiple layers of active components, 3D …